Facts About Wafer Dicing

When it comes to manufacturing electronic components, few things are as important as silicon wafer dicing . But what is exactly meant by this term and what does it entail? Here is a breakdown in layman’s terms about the process of wafer dicing.

During this very important process, there will be die removed from the silicon wafer. This is done after the processing of the semiconductor wafer is complete. The dicing is typically done by one of three ways. The first method is done by scribing and breaking the wafer, the second is by using a machine called a dicing saw to mechanically saw the wafer, and the third method is to cut it with a laser. No matter what method is used, it will be an automated one. The automation is to ensure that the process is done in as precise a manner as possible as well as accurately as possible.

After this process of , silicon wafer dicing is complete, the wafers will then be placed in a chip carrier where they can then be used in building a vast array of electronic devices and gadgets including computers, smartphones, and a host of others.

When the process of dicing is actually going on, the wafers will be held in place by what is known as dicing tape. This is a type of tape which has a sticky side to ensure it is held on a thin frame of sheet metal. The tape typically comes in two varieties. Tape with a UV cure is used for smaller wafers while tape without UV curing is used for wafers of a larger size. After being diced, the wafers stay stuck to the tape until they are removed by special equipment called die sorters. This happens much further down the assembly process.

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